Global 5G Printed Circuit Board Market Size By Type (HDI/Microvia/Build-Up, IC Substrate), By Application (Consumer Electronics, Computer), By Region, And Segment Forecasts, 2023 to 2032

Report Id: 19850 | Published Date: Mar 2025 | No. of Pages: | Base Year for Estimate: Mar 2025 | Format:


The Global 5G Printed Circuit Board (PCB) Market was valued at USD 4.8 billion in 2023 and is expected to surpass USD 12.3 billion by 2031, growing at a CAGR of 12.5% during the forecast period from 2023 to 2031. The growth of this market is driven by the increasing adoption of 5G technology, advancements in PCB design and materials, and the rising demand for compact, high-performance electronic devices. 5G PCBs are crucial for supporting the high-speed, low-latency requirements of next-generation telecommunications, enhancing connectivity across industries.

Drivers

Expansion of 5G Networks: The global deployment of 5G infrastructure is significantly increasing the demand for high-frequency, high-speed PCBs capable of supporting advanced communication technologies.

Technological Advancements in Electronics: The miniaturization of devices and the integration of Internet of Things (IoT) technologies are driving innovations in PCB manufacturing for enhanced performance.

Rising Demand in Consumer Electronics: The proliferation of 5G-enabled devices, such as smartphones and wearable gadgets, is fueling the market's growth.

Restraints

High Manufacturing Costs: The production of 5G PCBs requires advanced materials and precise manufacturing processes, which increase overall costs and may limit accessibility for smaller players.

Complex Design Requirements: The high complexity of 5G PCB designs demands skilled expertise and sophisticated technology, posing challenges for manufacturers.

Opportunity

Emerging Markets: Developing economies present lucrative opportunities as they continue to adopt 5G networks and increase investments in telecommunications infrastructure.

Automotive and Industrial Applications: The integration of 5G in autonomous vehicles and smart manufacturing processes is expected to create significant growth opportunities for specialized PCBs.

Market by System Type Insights

The Multilayer PCB segment dominated the market in 2023, driven by its high reliability and performance in supporting the complex requirements of 5G devices.

High-Frequency PCB is anticipated to witness the highest growth due to its ability to operate efficiently at higher frequencies needed for 5G applications.

Market by End-use Insights

The Telecommunications segment was the largest revenue contributor in 2023, accounting for more than 50% of the market share. The ongoing rollout of 5G infrastructure is the primary driver for this segment.

The Automotive sector is projected to grow significantly, driven by advancements in connected and autonomous vehicles leveraging 5G capabilities.

Market by Regional Insights

North America held the largest market share in 2023, supported by the early adoption of 5G technology and strong investments in R&D.

The Asia-Pacific region is expected to witness the highest growth rate during the forecast period, fueled by rapid advancements in 5G infrastructure and the presence of leading PCB manufacturers in countries like China, South Korea, and Japan.

Competitive Scenario

Key players in the Global 5G PCB Market include TTM Technologies, Inc., Nippon Mektron, Ltd., Samsung Electro-Mechanics, Zhen Ding Technology, Unimicron Technology Corp., AT&S Austria Technologie & Systemtechnik AG, and Compeq Manufacturing Co., Ltd. Companies are focusing on innovations, strategic collaborations, and expanding their global footprint to strengthen their market presence.

Scope of Work – Global 5G Printed Circuit Board Market

Report Metric

Details

Market Size (2023)

USD 4.8 billion

Projected Market Size (2031)

USD 12.3 billion

CAGR (2023-2031)

12.5%

Key Segments Covered

System Type, End-use, Region

Leading System Type

Multilayer PCB

Key Growth Drivers

Expansion of 5G Networks, Demand in Consumer Electronics

Key Opportunities

Emerging Markets, Automotive Applications

Key Market Developments

2023: TTM Technologies, Inc. introduced advanced high-frequency PCBs optimized for 5G base stations.

2024: AT&S expanded its manufacturing capacity in Southeast Asia to meet the growing demand for 5G-related PCBs.

2025: Samsung Electro-Mechanics launched a new series of multilayer PCBs designed for 5G-enabled IoT devices.

FAQs

What is the current market size of the Global 5G Printed Circuit Board Market? The market was valued at USD 4.8 billion in 2023.

What is the major growth driver of the Global 5G Printed Circuit Board Market? The expansion of 5G networks and the rising demand for high-performance electronic devices are key drivers.

Which is the largest region during the forecast period in the Global 5G Printed Circuit Board Market? North America held the largest market share, while Asia-Pacific is expected to witness the highest growth rate.

Which segment accounted for the largest market share in the Global 5G Printed Circuit Board Market? The Multilayer PCB segment was the largest revenue contributor in 2023.

Who are the key market players in the Global 5G Printed Circuit Board Market? Key players include TTM Technologies, Nippon Mektron, Samsung Electro-Mechanics, Zhen Ding Technology, and AT&S. 

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